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U6805B
Hex-Driver with Thermal Monitoring
Description
The hex-driver IC includes 6 non-inverted and current limited output stages with an open collector. Common thermal shutdown protects outputs against critical junction temperature. Each output can sink 20 mA, parallel output operation is possible. The digital inputs have Schmitt-trigger function with pull-up current sources to 5 V.
Features
D Six input comparators with Schmitt-trigger
characteristic
D ESD protection to human body model: D Output stages:
D Input clamping current capability to
dedicated to all input stages
"10 mA
"2000 V (C = 100 pF, R = 1.5 kW)
D Integrated protection cells (EMC, ESD, RF) D Common shutdown by junction temperature monitor D Low voltage reset with hysteresis
- Short circuit protected with diode - Load-dump protected @ 1 kW - No crosstalk on adjacent channels - Clamping current @ - 2 mA - Jump start possible
Ordering Information
Extended Type Number U6805B-FP Package SO14 Remarks
Block Diagram
VO1 1 VO2 VO3 2 3 VO4 VO5 5 6 VO6 7
VS
11
Thermal shutdown
4
GND
Under voltage detection VS=5 V 14 VI1 13 VI2 12 VI3 Figure 1. 10 VI4 9 VI5 8 VI6
13334
VS
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U6805B
Pin Description
VO1 VO2 VO3 GND VO4 VO5 VO6 1 14 VI1 13 VI2 12 VI3 11 VS
2
3
4
5
10 VI4 9 VI5 VI6
6
Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14
7
13335
8
Symbol VO1 VO2 VO3 GND VO4 VO5 VO6 VI6 VI5 VI4 VS VI3 VI2 VI1
Function Output 1 Output 2 Output 3 Ground Output 4 Output 5 Output 6 Input 6 Input 5 Input 4 Supply voltage, 5 V Input 3 Input 2 Input 1
Figure 2. Pinning
Basic Circuitry
Integrated circuit, U6805B, requires a stabilized supply voltage (VS = 5 V"5%) to comply with its electrical characteristics. An external buffer capacitor of C = 100 nF value is recommended. An integrated 14-V Z-diode between VS and ground protects the supply pin. All input stages are provided with an integrated 250 kW pull-up resistor and can be directly connected to a microcontroller. All output stages are open collectors each capable of sinking 20 mA. Recommended external components: Pull-up resistor, R = 1 kW Capacitor to GND, C = 470 pF, see figure 3
Current Limitation of the Output Stages and Overtemperature Shut-down
A temperature dependent current limitation between 25 and 100 mA protects the stages during a short. Additionally the chip temperature is monitored. For Tchip > 148_C all outputs are disabled and automatically enabled with a hysteresis of DTChip > 5 K. Refer to hexdriver U6807B if the temperature shut down is not required.
Transients and Load-Dump
An integrated 28-V Z-diode protects each output stage against transients and load-dump (Schaffner pulses). With the help of external 1-kW resistor , the output transistor is capable of the corresponding current which flows during each of these conditions. Apart from that, outputs are short circuit and overload protected.
Functional Description
General ON state: Low level at the input stage activates the corresponding output stage. OFF state: The internal pull-up resistor gives high level to the input comparator and deactivates the output stage. 7-V Z-diodes between each input pin and GND are capable of mA clamping currents without crosstalk on adjacent input stages. A total clamping current of mA should be observed with respect to the power dissipation.
Low Voltage Detection
When supply voltage is switched on, a power-on reset pulse is generated internally, which disables all output stages until a defined supply voltage level is reached. The low voltage detection is provided with a hysteresis of Vhyst = 0.5 V typically.
"10
"30
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U6805B
Absolute Maximum Ratings
Parameters Supply voltage Ambient temperature range Storage temperature range Maximum junction temperature Symbol VS Tamb Tstg Tj Value 7.0 -40 to +125 -50 to +150 +150 Unit V
_C _C _C
Thermal Resistance
Parameters Junction ambient Symbol RthJA Value 120 Unit K/W
Electrical Characteristics
VS = 5 V"5%, Tamb = 25_C, reference point pin 4 (GND), unless otherwise specified, see figure 1. Parameters Supply Supply voltage Supply current Low voltage detection threshold Low voltage hysteresis Temperature shut down Temperature shut-down hysteresis Inputs Pins 8, 9, 10, 12, 13 and 14 VI II RI OFF ON Pins 1, 2, 3, 5, 6 and 7 VO ILeak VSat Ilimit td 25 5 26.5 5 2.5 0.7 V pF V mA VI VI Vhyst 170 250 3.3 1.8 1.5 6.7 Inputs open Inputs closed to GND ON OFF Pin 11 VS IS IS VTH(ON) VTH(OFF) Vhyst TChip Thyst 4.75 0.8 7 3.7 3.0 0.55 140 5 5.25 3.2 13 4.6 3.8 1.05 149 V mA mA V V V Test Conditions / Pins Symbol Min. Typ. Max. Unit
_C _C
Z-diode protection voltage Z-diode clamping current Pull-up resistor Switching threshold Hysteresis Outputs Integrated capacitor Leakage current Saturation voltage (I = 20 mA) Current limitation Propagation delay (470 pF, 1 kW, 20 V)
"10
305
8.5
V mA kW V V V
Z-diode protection voltage
mA ms
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U6805B
Application Circuit
VS=5 V 100 nF VI1 VI2 VI3 Micro controller VI4 VI5 VI6 VO1 VO2 VO3 VO4 VO5 VO6 C C C C C C 6x 470 pF
13336
VBatt Load R R R R R R 6x 1k
U6805B
Hexdriver IC
Figure 3. Application schematic
Package Information
Package SO14
Dimensions in mm
5.2 4.8 8.75 3.7
1.4 0.4 1.27 7.62 14 8 0.25 0.10 0.2 3.8 6.15 5.85
technical drawings according to DIN specifications 13035
14
8
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Ozone Depleting Substances Policy Statement
It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances ( ODSs). The Montreal Protocol ( 1987) and its London Amendments ( 1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2 . Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency ( EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C ( transitional substances ) respectively. TEMIC can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.
We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 49 ( 0 ) 7131 67 2831, Fax number: 49 ( 0 ) 7131 67 2423
TELEFUNKEN Semiconductors Rev. A3, 28-Apr-97
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